Methods of forming patterns across photoresist and methods of forming radiation-patterning tools

A method of forming a pattern across an expanse of photoresist, comprising:

• defining a first region of the expanse, a second region of the expanse, and a third region of the expanse;
• exposing the first region of the expanse to a first radiation while leaving the third region of the expanse not exposed to the first radiation;
• after exposing the first region of the expanse to the first radiation, exposing the second region of the expanse to a second radiation while leaving the third region of the expanse not exposed to the second radiation, the second radiation being different from the first radiation;
• wherein the exposure of the first and second regions of the expanse to the first and second radiations alters the solubility of the first and second regions in a solvent relative to the solubility of the third region of the expanse;
• after exposing the first and second regions of the expanse to the first and second radiations, exposing the expanse to the solvent to pattern the expanse;
• wherein the photoresist is chemical amplification resist;
• wherein the first region includes a first feature formed in the patterned expanse of photoresist to a first minimum feature size;
• wherein the second region includes a second feature formed in the patterned expanse of photoresist to a second minimum feature size;
• and
• wherein the difference between the first and second radiation causes the second minimum feature size to be more similar to the first minimum feature size than it would be if the first and second radiations were not different from one another.

A method of forming a pattern across an expanse of photoresist, comprising:

• defining a first region of the expanse, a second region of the expanse, and a third region of the expanse;
• exposing the first region of the expanse to a first dose of radiation while leaving the third region of the expanse not exposed to the first dose of the radiation;
• after exposing the first region of the expanse to the first dose of the radiation, exposing the second region of the expanse to a second dose of the radiation while leaving the third region of the expanse not exposed to the second dose of the radiation;
• the second dose being different from the first dose;
• wherein the exposure of the first and second regions of the expanse to the radiation alters the solubility of the first and second regions in a solvent relative to the solubility of the third region of the expanse in the solvent;
• after exposing the first and second regions of the expanse to the radiation, exposing the expanse to the solvent to pattern the expanse;
• wherein the photoresist is chemical amplification resist;
• wherein the first region includes a first feature formed in the patterned expanse of photoresist to a first width;
• wherein the second region includes a second feature formed in the patterned expanse of photoresist to a second width;
• and
• wherein the difference between the first and second doses causes the second width to be more similar to the first width than it would be if the first and second doses were not different from one another.

A method of forming a pattern across an expanse of photoresist, comprising:

• defining a first region of the expanse, a second region of the expanse, and a third region of the expanse;
• exposing the first region of the expanse to a first dose of radiation while leaving the third region of the expanse not exposed to the first dose of the radiation;
• after exposing the first region of the expanse to the first dose of the radiation, exposing the second region of the expanse to a second dose of the radiation while leaving the third region of the expanse not exposed to the second dose of the radiation;
• the second dose being different from the first dose;
• wherein the exposure of the first and second regions of the expanse to the radiation alters the solubility of the first and second regions in a solvent relative to the solubility of the third region of the expanse in the solvent;
• after exposing the first and second regions of the expanse to the radiation, exposing the expanse to the solvent to pattern the expanse;
• wherein the photoresist is chemical amplification resist;
• wherein the first region includes a first feature formed in the patterned expanse of photoresist to a first minimum feature size;
• wherein the second region includes a second feature formed in the patterned expanse of photoresist to a second minimum feature size;
• and
• wherein the difference between the first and second doses causes the second minimum feature size to be more similar to the first minimum feature size than it would be if the first and second doses were not different from one another.

A method of forming a pattern across an expanse of chemical amplification photoresist, comprising:

• sequentially exposing regions of the expanse to radiation while not exposing other regions of the expanse to the radiation;
• the radiation changing in dose over a time of the exposure of the regions so that a region exposed early to the radiation is exposed to a different dose than a region exposed later to the radiation;
• the exposed regions of the expanse having an altered solubility in a solvent relative to the non-exposed regions of the expanse;
• after exposing the regions of the expanse to the radiation, exposing the expanse to the solvent to pattern the expanse;
• and
• wherein the change in the dose of the radiation causes a minimum feature dimension of the region exposed earlier to the radiation to be more similar to a minimum feature dimension of the region exposed later to the radiation than it would be if the radiation dose did not change over time.