Method for controlling a temperature of a microelectronic substrate

A method for controlling a temperature of a microelectronic substrate in connection with disposing a liquid on a first surface of the substrate, comprising:

• positioning the microelectronic substrate on a support of a liquid dispensing apparatus;
• prior to positioning the microelectronic substrate on the support, generating a temperature distribution over the first surface of the substrate by directing a fluid directly against a second surface of the microelectronic substrate, the second surface being opposite from the first surface;
• controlling a first rate of heat transfer directly to or from a first portion of the second surface of the substrate, wherein controlling a first rate of heat transfer includes directing a gas through a nozzle to impinge directly against the second surface of the substrate;
• controlling a second rate of heat transfer directly to or from a second portion of the second surface of the substrate, the second heat transfer rate being different than the first heat transfer rate;
• and
• disposing the liquid on the first surface of the substrate.

A method for controlling a temperature of a microelectronic substrate during application of a liquid to the substrate, the substrate having a first surface and a second surface opposite the first surface, the method comprising:

• positioning the substrate on a support of a liquid application apparatus;
• prior to positioning the substrate on the support, generating a temperature distribution over the first surface of the substrate by directing a fluid directly against the second surface of the microelectronic substrate;
• disposing the liquid on the first surface of the substrate;
• rotating the substrate to distribute the liquid over the first surface of the substrate;
• and
• directing a gas flow directly against the second surface of the substrate to control a temperature of the first surface of the substrate, wherein directing a gas flow includes directing a first gas flow toward a first portion of the substrate to transfer heat to or from the first portion at a first rate and directing a second gas flow toward the second portion of the substrate to transfer heat to or from the second portion at a second rate different than the first rate.