Anodizing apparatus, utilizing a perforated negative electrode
AssigneeCanon Kabushiki Kaisha
InventorsSatoshi Matsumura, Kenji Yamagata
Life of this patent
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Abstract
This invention is to reduce the influence of a gas generated by an anodizing reaction. A silicon substrate (101) to be processed is horizontally held. A negative electrode (129) is arranged on the upper side of the silicon substrate (101), and a positive electrode (114) is brought into contact with the lower surface of the silicon substrate (101). The space between the negative electrode (129) and the silicon substrate (101) is filled with an HF solution (132). The negative electrode (129) has a number of degassing holes (130) to prevent a gas generated by the anodizing reaction from staying on the lower side of the negative electrode (129).
Claims35
An anodizing apparatus for anodizing a silicon substrate, comprising:
- a holding portion for substantially horizontally holding the substrate;
- a perforated negative electrode arranged above the substrate to oppose the substrate;
- a positive electrode arranged under the substrate;
- and
- an anodizing tank for filling a space between the substrate and said negative electrode with an electrolyte,
- wherein said perforated negative electrode is adapted to prevent a gas from staying on a lower side.
An anodizing system comprising:
- an anodizing apparatus for anodizing a silicon substrate;
- a conveyor robot for transferring an unprocessed silicon substrate to said anodizing apparatus, receiving the processed silicon substrate from said anodizing apparatus, and conveying the processed silicon substrate to a predetermined position;
- and
- a control section for controlling anodizing by said anodizing apparatus and substrate conveyance by said conveyor robot;
- wherein said anodizing apparatus including:
- a holding portion for substantially horizontally holding a silicon substrate to be anodized;
- a perforated negative electrode arranged above the silicon substrate to oppose the substrate;
- a positive electrode arranged under the silicon substrate;
- and
- an anodizing tank for filling a space between the silicon substrate and said negative electrode with an electrolyte,
- wherein said perforated negative electrode is adapted to prevent a gas from staying on a lower side.
An anodizing system comprising:
- an anodizing apparatus for anodizing a silicon substrate;
- a conveyor robot for transferring an unprocessed silicon substrate to said anodizing apparatus while supporting the unprocessed silicon substrate from a lower side in substantially horizontal state, receiving the anodized silicon substrate from said anodizing apparatus while supporting the anodized silicon substrate from the lower side in the substantially horizontal state, and conveying the anodized silicon substrate to a predetermined position;
- and
- a control section for controlling anodizing by said anodizing apparatus and substrate conveyance by said conveyor robot;
- wherein said anodizing apparatus including:
- a holding portion for substantially horizontally holding a silicon substrate to be anodized;
- a perforated negative electrode arranged above the silicon substrate to oppose the substrate;
- a positive electrode arranged under the silicon substrate;
- and
- an anodizing tank for filling a space between the silicon substrate and said negative electrode with an electrolyte,
- wherein said perforated negative electrode is adapted to prevent a gas from staying on a lower side.
An anodizing system comprising:
- an anodizing apparatus for anodizing a silicon substrate;
- a washing/drying apparatus for washing and drying an anodized silicon substrate anodized by said anodizing apparatus;
- a conveyor robot for transferring an unprocessed silicon substrate to said anodizing apparatus, receiving the anodized silicon substrate from said anodizing apparatus, transferring the anodized silicon substrate to said washing/drying apparatus, receiving the washed and dried silicon substrate from said washing/drying apparatus, and conveying the washed and dried silicon substrate to a predetermined position;
- and
- a control section for controlling anodizing by said anodizing apparatus, washing/drying by said washing/drying apparatus, and substrate conveyance by said conveyor robot;
- wherein said anodizing apparatus including:
- a holding portion for substantially horizontally holding a silicon substrate to be anodized;
- a perforated negative electrode arranged above the silicon substrate to oppose the substrate;
- a positive electrode arranged under the silicon substrate;
- and
- an anodizing tank for filling a space between the silicon substrate and said negative electrode with an electrolyte,
- wherein said perforated negative electrode is adapted to prevent a gas from staying on a lower side.
Dependencies are inferred from the claim text.