US 6,543,521 B1 · Cooling element and cooling apparatus using the same

Abstract

The cooling element of the present invention comprises a base section in contact with a heat producing element, and a heat dissipation section integrally formed with the base section. The cooling element of the present invention is constructed such that a ratio of T (a thickness of the base section) to L (a reference length, namely, a shortest width or an external diameter of the base section disposed right above the heat producing element) is within a range of not less than 0.14 and not more than 0.24. The cooling element of the present invention comprises a base section in contact with a heat producing element and a heat dissipation element integrally formed with the base section. The cooling element of the present invention is constructed such that a ratio of d (a length of the base section at around the center) to L2 (a longest length or an external diameter of said base section) is not less than 0.5.

Claims2

Dependent claims

A cooling element for semiconductor devices comprising:

a base section in contact with a heat producing element;
and
a heat dissipation section integrally formed with said base section, said heat dissipation section having a plurality of fins formed on a surface thereof, said fins having a shape selected from the group consisting of a square pole, a cylinder, a polygonal pole and an elliptic cylinder,
wherein a ratio of T/L is within a range of not less than 0.14 and not more than 0.24, where
T is thickness of said base section, and
L is one of a shortest width and an external diameter of said base section disposed right above said heat producing element, and corners of said base section and said heat dissipation section are chamfered.

3 more elements

Dependencies are inferred from the claim text.

Cooling element and cooling apparatus using the same

Life of this patent

Cooling element and cooling apparatus using the same

Life of this patent

Abstract

Claims2