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US 6,524,758 B2Granted
Method of manufacture of printed wiring boards and flexible circuitry
AssigneeElectrox Corporation
InventorsDietmar C. Eberlein, Robert H. Detig
Life of this patent
Estimating the term…
Abstract
The present invention relates to the fabrication process for the printed wiring boards and flex circuits. An electrostatic printing plate includes a substrate with an image receiving layer applied thereto. The image receiving layer is a toner with a metallic toner and subsequently fixed in place or is transferred to a layer. The metal toner is then fixed on this receiving surface.
Claims7
A printed wiring board comprising a substrate;
- a photo imaginable dielectric layer coated onto the substrate, wherein at least a portion of the dielectric layer is cross-linked and wherein the cross-linked portion has a toner adhered thereto, wherein the toner comprises a member selected from the group consisting of silver and silver alloys.
Dependencies are inferred from the claim text.