Gasketed cover, cover for electronic equipment and process for producing the covers
AssigneeBridgestone Corporation
InventorsYouichi Nishimuro, Shinichi Toyosawa, Kunio Machida
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AssigneeBridgestone Corporation
InventorsYouichi Nishimuro, Shinichi Toyosawa, Kunio Machida
Estimating the term…
There are disclosed a first gasketed cover which has excellent sealing properties and comprises a cover body composed of a thermoplastic resin and a gasket composed of a thermoplastic elastomer and integrated with the cover body; a second gasketed cover which has excellent sealing properties and is capable of preventing the generation of noises due the vibration of the cover and which comprises a cover body, a gasket composed of an elastic body and integratedly attached to the cover body, and a member composed of the elastic body of a type same as or different from that in the gasket and integratedly installed on at least part of the cover body plane portion excluding the gasket portion; an electronic equipment cover which is capable of preventing pressure difference between the inside and the outside thereof and which comprises a cover body and a membrane composed of an elastic body and installed on a hole placed on the plane portion of the cover body, in which the cover body is integrated with the membrane; and processes for producing the first and second gasketed covers and the electronic equipment cover each by any of two-color molding method and inserting molding method.
A gasketed cover comprising a cover body which is composed of a thermoplastic resin and a gasket which is composed of a thermoplastic elastomer, said cover body being fitted with said gasket and integrated therewith, wherein the thermoplastic resin is incorporated with a filler capable of imparting electroconductivity thereto, and said thermoplastic resin incorporated with a filler has a volume resistivity of at most 1×108 Ω cm.
A gasketed cover comprising a cover body which is composed of a thermoplastic resin;
An electronic equipment cover comprising a cover body which is composed of a thermoplastic resin and a membrane which is composed of an elastic body and is installed on a hole placed on the plane portion of the cover body, said cover body and said membrane being integrated with each other, wherein the thermoplastic resin is incorporated with a filler capable of imparting electroconductivity thereto, and said thermoplastic resin incorporated with a filler has a volume resistivity of at most 1×108 Ω cm.
Dependencies are inferred from the claim text.