Compressible thermally-conductive interface
AssigneeAmerasia International Technology, Inc.
InventorKevin Kwong-Tai Chung
Life of this patent
Estimating the term…
Abstract
A compressible and melt-flowable thermally conductive interface may be either tacky and pressure sensitive or be non-tacky and dry, and may include one of more thermally conductive fillers in one or more forms. The interface either melt flows or cures at low temperature, such as about 40-50° C. Certain embodiments provide a bond strength between a heat generating component, such as an integrated circuit, power transistor and the like, and a heat dissipating element, such as a heat sink or cold plate, sufficient to permit elimination of the need for mechanical fasteners.
Claims39
A compressible and melt-flowable thermally conductive interface comprising:
- at least one heat generating element;
- a heat dissipating element adapted for receiving heat from said at least one heat generating element;
- a compressible and melt flowable thermally conductive interface pad or sheet disposed between said heat generating element and said heat dissipating element and in contact therewith, said thermally conductive interface pad or sheet comprising a blend of a compressible and melt flowable binder and at least one thermally conductive filler,
- wherein said compressible and melt flowable binder includes one of (a) a mixture of a thermoplastic rubber and a compatible thermoplastic pressure sensitive adhesive, and a wax, melt flowable at less than 75° C., (b) a mixture of an epoxy blend and a curing agent for curing at less than 75° C. and a compatible thermoplastic pressure sensitive adhesive and (c) a mixture of an epoxy blend and a curing agent for curing at less than 75° C. and a compatible thermoplastic rubber or elastomer.
A compressible and melt flowable thermally conductive interface pad or sheet comprising a blend of a compressible and melt flowable binder and at least one thermally conductive filler, wherein said compressible and melt flowable binder includes one of (a) a mixture of a thermoplastic rubber and a compatible thermoplastic pressure sensitive adhesive, (b) a mixture of an epoxy blend and a curing agent for curing at less than 75° C. and a compatible thermoplastic pressure sensitive adhesive and (c) a mixture of an epoxy blend and a curing agent for curing at less than 75° C. and a compatible thermoplastic rubber or elastomer.
An electronic assembly comprising:
- at least one electronic device capable of dissipating at least 1 watt during operation;
- a heat dissipating device adapted for receiving heat from said at least one electronic device;
- a compressible and melt flowable thermally conductive interface pad disposed between said electronic device and said heat dissipating device and in contact therewith, wherein said thermally conductive interface pad is compressible by at least ten percent (10%) at a temperature of about 25° C. and melt flowable at a temperature between 40° C. and 80° C., under a pressure of 5 psi or greater;. and
- at least one fastener for causing at least the 5 psi pressure between :said electronic device and said heat dissipating device.
An electronic assembly comprising:
- at least one electronic device capable of dissipating at least 1 watt during operation;
- a heat dissipating device adapted for receiving heat from said at least one electronic device;
- an in situ curable thermally conductive interface pad disposed between said electronic device and said heat dissipating device and in contact therewith, wherein said in situ curable thermally conductive interface pad is (i) compressible by at least ten percent (10%) at a temperature of about 25° C. under a pressure of 5 psi or greater, (ii) provides a bond strength of at least 50 psi immediately upon placement under a pressure of 5 psi or greater, and (iii) cures in situ at a temperature between 40° C. and 80° C. to provide a cured bond strength of at least 300 psi.
An electronic assembly comprising:
- at least one electronic device capable of dissipating at least 1 watt during operation;
- a heat dissipating device adapted for receiving heat from said at least one electronic device;
- an in situ curable thermally conductive interface pad disposed between said electronic device and said heat dissipating device and in contact therewith, wherein said in situ curable thermally conductive interface pad (i) is compressible by at least ten percent (10%), (ii) melt flows at a given temperature between about 40-125° C. under a pressure of 5 psi or greater, (iii) provides a bond strength of at least 50 psi immediately upon placement under a pressure of 5 psi or greater, and (iv) initiates curing in situ when raised to a temperature not less than 40° C. to provide a cured bond strength of at least 300 psi.
A compressible thermally conductive interface pad or sheet comprising a blend of a compressible binder and at least one thermally conductive filler, wherein said compressible binder includes a mixture of a thermoplastic rubber and a thermoplastic pressure sensitive adhesive, wherein said mixture of a thermoplastic rubber and a thermoplastic pressure sensitive adhesive further comprises a wax melt flowable at less than 75° C.
A compressible thermally conductive interface pad or sheet comprising a blend of a compressible binder and at least one thermally conductive filler, wherein said compressible binder includes one of:
- (a) a mixture of an epoxy blend and a curing agent for curing at less than 75° C. and a thermoplastic pressure sensitive adhesive and
- (b) a mixture of an epoxy blend and a curing agent for curing at less than 75° C. and a thermoplastic rubber or elastomer,
- wherein said curing agent is a solid state curing agent that is activated by increasing its temperature to above 40° C.
Dependencies are inferred from the claim text.