Multilayered diffusion barrier structure for improving adhesion property
AssigneeSimplus Systems Corporation
InventorTue Nguyen
Life of this patent
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Abstract
A method has been provided for improving the adhesion of copper to a nitrided metal diffusion barrier material, such as TiN, in an integrated circuit substrate. The method provided a multilayered diffusion barrier structure, comprising a nitrided metal diffusion barrier layer and an oxy-nitrided metal layer. The formation of an oxy-nitrided metal layer, instead of an oxide layer, permits the optimization of both contact resistance and adhesion property. The oxy-nitrided metal layer is formed either by the partial incorporation of oxygen into the nitrided metal diffusion barrier or by deposition in an oxygen ambient.
Claims24
A method to form a multilayered diffusion barrier structure on an underlayer for improving adhesion to a subsequently deposited layer, the method comprises the steps of:
- a) depositing a nitrided metal diffusion barrier layer on the underlayer in a diffusion barrier deposition equipment, whereby this diffusion barrier layer serves as a barrier between the underlayer and the subsequently deposited layer;
- b) forming a thin metal nitrogen-rich oxy-nitride layer by oxy-nitriding the diffusion barrier material surface, this oxy-nitride layer comprises the metal species, nitrogen species, and oxygen species, the oxygen species being less than the nitrogen species, whereby this layer serves to improve the adhesion of the multilayered diffusion barrier structure to the subsequently deposited layer.
A method to deposit a multilayered diffusion barrier structure on an underlayer for improving adhesion to a subsequently deposited layer, the method comprises the steps of:
- a) depositing a nitrided metal diffusion barrier layer on the underlayer in a diffusion barrier deposition equipment, whereby this diffusion barrier layer serves as a barrier between the underlayer and the subsequently deposited layer;
- b) depositing a thin metal nitrogen-rich oxy-nitride layer, this oxy-nitride layer comprises the metal species, nitrogen species, and oxygen species, the oxygen species being less than the nitrogen species, whereby this layer serves to improve the adhesion of the multilayered diffusion barrier structure to the subsequently deposited layer.
Dependencies are inferred from the claim text.