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US 6,489,392 B1Granted
Foamed resin adhesive and the use thereof of glueing wood based panels and boards
AssigneeDynea Chemicals Oy
InventorsEsa Lappalainen, Niko Musakka
Life of this patent
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Abstract
A foamed resin adhesive and its use for glueing wood based panels and boards such as plywood. The adhesive comprises 40-80% of an aqueous resin solution, 2-10% of an organic filler or fillers, 1-10% of a cationic acrylamide copolymer, and 0.05-1% of a surface active agent.
Claims13
A foamable resin adhesive for glueing wood based boards wherein the adhesive comprises 40-80% of an aqueous resin solution, 2-10% of an organic filler or fillers, 1-10% of a cationic, acrylamide copolymer, and 0.05-1% of a s active agent.
The resin adhesive according to clam 12, wherein he surface active agent is sodium (2-ethylhexyl) sulfate.
Dependencies are inferred from the claim text.