Heat dissipating device adapted to be applied to a flip chip device

A heat-dissipating device adapted to cover a flip chip base that is mounted with a chip device thereon, said heat dissipating device comprising:

• a heat-conductive base plate adapted to be mounted on the flip chip base, said base plate having a lower surface adapted to be disposed in contact with the flip chip base, and an upper surface opposite to said lower surface, said base plate being formed with a through hole that extends from said upper surface to said lower surface;
• a heat-conductive block formed integrally on said upper surface of said base plate and covering said through hole in said base plate, said block having a bottom surface flush with said upper surface of said base base plate, and a top surface opposite to said bottom surface, said bottom surface having an area larger than that of said through hole, and being formed with a recess that is registered with said through hole in said base plate such that when said base plate is used to cover the flip chip base, said through hole in said base plate allows the chip device to extend into said recess;
• and
• a plurality of heat-dissipating members formed integrally on said upper surface of said base plate.