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US 6,487,076 B1Granted
Compact heat sink module
AssigneeAuras Technology Co., Ltd.
InventorRu-Ching Wang
Life of this patent
Estimating the term…
Abstract
A compact heat sink module is able to provide a compact heat sink for installation in a notebook computer. Furthermore the heat sink module has an effective cooling ability for keeping a normal operation temperature of a CPU by multiple conductors conducting heat from the CPU and a fan surrounded within the conductors.
Claims8
A compact heat sink module adapted for use with a CPU, the compact heat sink module comprising:
- a body separately connected on a base for connection to the CPU to carry heat from the CPU away, wherein the body comprises:
- at least one assembling device connected on a surface of the base;
- a conducting block connected to the at least one assembling device for connecting to the CPU;
- at least one conductor connected to the at least one assembling device for dispersing heat from the conducting block, and a plurality of gaps defined in at least one conductor;
- and
- a fan mounted to the base and retained within the at least one assembling device and the conducting block, wherein the fan has a heat exchange function with the at least one conductor and the conducting block, whereby heat generated by the CPU is effectively dispersed by the heat sink module.
3 more elements
Dependencies are inferred from the claim text.