Microelectronic assembly incorporating lead regions defined by gaps in a polymeric sheet
AssigneeTessera, Inc.
InventorsJohn W. Smith, Joseph Fjelstad
Life of this patent
Estimating the term…
Abstract
A sheet such as a polymeric dielectric has elongated lead regions partially separated from the main region of the sheet by gaps in the sheet, and has conductors extending along the lead regions. The lead regions are connected to contacts on a microelectronic element, and the microelectronic element is moved away from the main region of the sheet, thereby bending the lead regions downwardly to form leads projecting from the main region of the sheet.
Claims21
A component for forming a microelectronic assembly comprising a sheet including a main region and a plurality of gaps partially surrounding and defining a set of flexible elongated lead regions of said sheet, each such lead region having a fixed end connected to said main region and a tip end remote from said fixed end, said sheet including a continuous layer of a polymeric material having oppositely-facing top and bottom surfaces extending within said main region and said lead regions, said lead regions of said sheet including metallic conductors extending on said polymeric layer between said tip ends and said fixed ends of said lead regions, at least some of said conductors being electrically isolated from the remaining said conductors and the component further including terminals disposed on said main region and electrically connected to at least some of said metallic conductors.
A microelectronic assembly comprising:
- (a) a microelectronic element having contacts thereon;
- (b) a sheetlike element including a polymeric dielectric layer, said sheetlike element overlying a surface of said microelectronic element, said sheetlike element having terminals thereon and having a plurality of openings extending therethrough, said sheetlike element having a top surface facing away from said microelectronic element and a bottom surface facing toward said microelectronic element;
- (c) a plurality of flexible leads projecting downwardly from said sheetlike element at said openings, each said flexible lead including a polymeric layer integral with said sheetlike element and at least one metallic conductor, at least some of said conductors being connected to said terminals and to said contacts;
- and
- (d) a compliant layer disposed between said microelectronic element and said sheetlike element, said compliant layer encapsulating said flexible leads and extending through said opening but not extending onto said top surface of said microelectronic element.
Dependencies are inferred from the claim text.