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US 6,486,540 B2Granted
Three-dimensional semiconductor device and method of manufacturing the same
AssigneeNEC Corporation
InventorsNaoji Senba, Takao Yamazaki, Yuzo Shimada
Life of this patent
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Abstract
A three-dimensional semiconductor device includes a cylindrical heat sink, wherein a CPU is provided on a substantially center of an inner bottom surface of the cylindrical heat sink, semiconductor chips are respectively mounted on an outer peripheral surface and an inner peripheral surface of the cylindrical heat sink, and the CPU is connected to an upper heat sink.
Claims28
A three-dimensional semiconductor device comprising:
- a supporting member having a three-dimensional shape allowing a plurality of semiconductor devices to be arranged in a columnar shape and containing as a main component a high heat-conductive material;
- a plurality of semiconductor devices attached to the supporting member;
- and
- a central processing unit (CPU) attached to said supporting member,
- wherein a distance from said CPU to each of said semiconductor devices is substantially the same.
2 more elements
A three-dimensional semiconductor device, comprising:
- a supporting member having a three-dimensional shape allowing a plurality of semiconductor devices to be arranged in a columnar shape and containing as a main component a high heat-conductive material;
- and
- a plurality of semiconductor devices attached to the supporting member,
- wherein the supporting member includes a columnar structure, and a plurality of semiconductor devices are attached onto at least one of an inner peripheral surface and an outer peripheral surface of the columnar structure.
1 more element
A three-dimensional semiconductor device, comprising:
- a supporting member having a three-dimensional shape allowing a plurality of semiconductor devices to be arranged in a columnar shape and containing as a main component a heat-conductive material, wherein the supporting member includes a curved surface;
- and
- a plurality of semiconductor devices mounted on said curved surface of said supporting member.
Dependencies are inferred from the claim text.