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US 6,486,538 B1Granted
Chip carrier having ventilation channels
AssigneeInfineon Technologies AG
InventorsMartin Reiss, Johann Winderl
Life of this patent
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Abstract
A chip carrier made of a non-metallic material has conductor tracks applied thereon for producing an external, two-dimensional connection configuration for electronic circuit chips. The chip carrier has a multiplicity of chip mounting locations and first cutouts disposed in such a way that at least one first cutout is adjacent each of the chip mounting locations. A second, channel-like cutout in the chip carrier leads from each chip mounting location to a first cutout adjacent the chip mounting location.
Claims4
A non-metallic chip carrier, comprising:
- a multiplicity of chip mounting locations disposed in at least two rows extending in a longitudinal direction;
- first cutouts, at least one of said first cutouts disposed adjacent each respective one of said chip mounting locations, and said first cutouts disposed as load-relief slots;
- and
- second cutouts, each leading from a respective one of said chip mounting locations to a respective one of said first cutouts adjacent said chip mounting location, and said second cutouts disposed as ventilation channels, and said first cutouts being each disposed between two respective chip mounting locations in the longitudinal direction.
1 more element
Dependencies are inferred from the claim text.