U-shape tape for BOC FBGA package to improve moldability
AssigneeMicron Technology, Inc.
InventorsLim T. Chye, Lee C. Kuan, Jeffery Toh, Tim Teoh, Patrick Guay, Choong L. Wah
Life of this patent
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Abstract
An FBGA packaged device including a die adhered to a substrate with a small gap being formed between the die and substrate. An opening is formed through the substrate adjacent the center portion of the die. An encapsulating mold is formed around the die extending into the gap and also filling the channel. At least one barrier is disposed in the gap between the substrate and the die adjacent the channel to control the flow path of the encapsulating material as the mold is formed in the package.
Claims13
A semiconductor package comprising:
- a substrate having a first surface, a second surface, and an elongated aperture therethrough, the aperture having a first and a second side, and a first and a second end;
- a die having a first surface and an outer perimeter, wherein the first surface of the die is coupled to the second surface of the substrate such that the die covers the elongated aperture except for the first end of the elongated aperture, the first end remaining exposed near the outer perimeter of the die allowing fluid communication between the first surface of the substrate and the second surface of the substrate through the exposed portion of the aperture;
- and
- a fluid barrier disposed on the second surface of the substrate between the die and the substrate adjacent the second end of the elongated aperture.
A semiconductor package comprising:
- a substrate having a first and a second surface and an aperture therethrough, the aperture having a first, a second, a third and a fourth edge;
- a die having a first surface and a perimeter edge, the first surface of the die being coupled to the second surface of the substrate such that the die covers the aperture except for the fourth edge of the aperture which remains exposed near the perimeter edge of the die allowing fluid communication between the first surface of the substrate and the second surface of the substrate through the exposed portion of the aperture;
- a fluid barrier disposed on the second surface of the substrate between the die and the substrate adjacent to the first, second and third edges of the aperture;
- and
- an encapsulating mold formed around the die and around at least a portion of the substrate.
Dependencies are inferred from the claim text.