Semiconductor contact and method of forming the same
AssigneeInfineon Technologies AG
InventorsThomas S. Rupp, Jeffrey P. Gambino, Peter Hoh, Senthil Srinivasan
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AssigneeInfineon Technologies AG
InventorsThomas S. Rupp, Jeffrey P. Gambino, Peter Hoh, Senthil Srinivasan
Estimating the term…
In one aspect, the present invention discloses a transistor device (see e.g., FIG. 3) that includes first and second source/drain regions 124a and 126 disposed in a semiconductor body 122 and separated by a channel region 128a. A dielectric layer 134a overlies the channel region 128a and a gate electrode 130a/132a overlies the dielectric layer 134a. In the preferred embodiment, the gate electrode includes a polysilicon layer 130a that extends a first lateral distance over the dielectric layer and a silicide layer 132a that extends a second lateral distance over the first polysilicon layer. In this example, the first lateral distance is greater than the second lateral distance.
A dynamic random access memory device including a transistor device, the memory device comprising:
Dependencies are inferred from the claim text.