Sealing arrangement for an electronic circuit module
AssigneeMotorola, Inc.
InventorsAndrew McCulloch, Roger Humphreys
Life of this patent
Estimating the term…
Abstract
A sealing arrangement is provided for sealing an orifice between an interior and an exterior surface of an electronic module. An air-permeable, water-impermeable membrane is disposed in the orifice. A portion of the exterior surface is provided with at least one surface channel which extends between the orifice and a distant point. A protective cover is attached to the exterior surface and arranged to overlie the membrane disposed about the orifice but not to overlie the distant point, thereby providing an air path to the interior surface of the module, via the surface channel and the membrane.
Claims5
A sealing arrangement for an electronic module, the sealing arrangement comprising:
- a section of a casing for the electronic module, the section of the casing having an orifice that extends from an upper surface of the casing to a lower surface of the casing, the upper surface of the casing facing an exterior of the electronic module, the lower surface facing an interior of the electronic module, the orifice having an upper chamber and a lower chamber, the upper chamber being larger in diameter than the lower chamber and defining an intermediate surface in the section of casing between the upper surface and the lower surface;
- an air-permeable, water-impermeable membrane, disposed in the orifice and attached to the intermediate surface in the section of casing;
- at least one surface channel, formed in the upper surface of the casing and extending from the upper chamber of the orifice to an extremity that is remote from the upper chamber;
- a protective cover, attached to the upper surface of the casing, and arranged to overlie the upper chamber of the orifice and the membrane disposed in the orifice, such that the channel extending from the upper chamber of the orifice to the extremity provides an air path to the interior of the electronic module, via the membrane.
A sealing arrangement for an electronic module, the sealing arrangement comprising:
- a section of a casing for the electronic module, the section of the module having an orifice that extends from an upper surface of the casing to a lower surface of the casing, the upper surface of the casing facing an exterior of the electronic module, the lower surface facing an interior of the electronic module;
- a relatively flat sealing gasket having a first side arranged to face and attach to the upper surface of the casing and a second side arranged to face away from the upper surface of the casing;
- an air-permeable, water-impermeable membrane, disposed in the relatively flat sealing gasket which covers the orifice;
- a protective cover arranged for covering and attaching to the relatively flat sealing gasket, the protective cover having a channel and a recess that are arranged to face the gasket, the channel and recess providing an air path to the interior of the electronic module, via the membrane.
Dependencies are inferred from the claim text.