System and method to facilitate removal of defects from a substrate
AssigneeAdvanced Micro Devices, Inc.
InventorsKhoi A. Phan, Bharath Rangarajan, Bhanwar Singh
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Abstract
A system and method are disclosed for facilitating removal of a defect from a substrate. A charge is applied at the surface of substrate, such as in the form of an ionized gas, to weaken attractive forces between the defect and the substrate. As a result of weakening the attractive forces, a suitable defect removal system may be employed to remove the defect.
Claims29
A method of facilitating removal of a defect relative to a substrate, comprising:
- employing a processing environment;
- employing a substrate supported located in the processing environment;
- employing an analyzing device for determining a composition of the defect;
- employing a source for applying a charge to a surface of the substrate for loosening the defect relative to the substrate;
- and
- employing a defect removal system associated with the processing environment for removing the defect relative to the substrate.
A system for facilitating defect removal, comprising:
- a processing environment;
- a substrate supported located in the processing environment;
- an analyzing device for determining a composition of at least one defect;
- a source operable to apply a charge to a surface of the substrate for loosening the at least one defect relative to the substrate;
- and
- a defect removal system associated with the processing environment for removing the at least one defect relative to the substrate.
The system of 24, further comprising a control system coupled to the locating device, the analyzing device and the source, the control system is capable of controlling the source to select the gas to direct at the defect based on at least one of the position and composition of the defect.
A system for facilitating defect removal, comprising:
- means for supporting a substrate for processing;
- means for analyzing a composition of at least one defect;
- means for applying a charge at the surface of the substrate within the means for processing to loosen the at least one defect relative to the substrate;
- and
- means for removing the at least one defect relative to the substrate.
Dependencies are inferred from the claim text.