Method of fabricating semiconductor devices with contact studs formed without major polishing defects

A method for providing a semiconductor device including contact studs for contacting a semiconductor substrate, said contact studs being embedded in an insulating structure, said method comprising the steps of:

• providing said semiconductor substrate;
• providing a first insulating layer on said semiconductor substrate;
• forming holes in the first insulating layer for exposing parts of the upper surface of the semiconductor substrate where said contact studs are to be formed;
• providing a contact material on the resulting structure;
• performing a first polishing step for removing said contact material from the upper surface of said first insulating layer such that said contact studs are formed;
• performing a cleaning step for removing residuals of said contact material from the upper surface of said first insulating layer;
• providing a second insulating layer on the resulting structure;
• and
• performing a second polishing step for exposing the upper surface of said contact studs.