Photopolymerizable thermosetting resin compositions
AssigneeCiba Specialty Chemicals Corporation
InventorsHidetaka Oka, Masaki Ohwa, Akira Matsumoto, Hisatoshi Kura
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AssigneeCiba Specialty Chemicals Corporation
InventorsHidetaka Oka, Masaki Ohwa, Akira Matsumoto, Hisatoshi Kura
Estimating the term…
Compositions comprising (A) an oligomer or polymer containing at least one carboxylic acid group in the molecule; (B) at least one compound of formulas (I, II, III, IV, V or VI), wherein R1 inter alia is phenyl or alkyl; R2 is for example C2-C12alkonoyl which is unsubstituted or substituted or is benzoyl; R3, R4, R5, R6 and R7 independently of one another are for instance hydrogen, C1-C12alkyl, cyclohexyl or phenyl which is unsubstituted or substituted, or are benzyl, benzoyl, C2-C12alkanoyl or phenoxycarbonyl; R8 is for example hydrogen or C1-C12alkyl or a group (B); M is for example C1-C12alkylene, cyclohexylene or phenylene; M1 inter alia is a direct bond or C1-C12alkylenoxy; and Ar is a 5- or 6-membered aromatic heterocyclic ring; (C) a photopolymerizable reactive or unreactive diluent; and (D) as a thermosetting component an epoxy compound containing at least two epoxy groups in one molecule; are highly suitable as resists which are alkaline developable.
Photosensitive thermosetting liquid composition comprising
Dependencies are inferred from the claim text.