High temperature process chamber having improved heat endurance

A high temperature process chamber having improved heat endurance comprising:

• a chamber body equipped with a wafer pedestal for holding a wafer thereon and for processing the wafer at a temperature of at least 200° C.;
• a lift cylinder positioned below and outside said chamber body for operating said wafer pedestal in an up-and-down motion, said cylinder further comprises components that are operable at temperatures below than 40° C.;
• and
• an adapter means situated between said wafer pedestal and said lift cylinder formed at least partially of a heat insulating material such that said high temperature of said wafer pedestal is substantially attenuated from said lift cylinder to allow the cylinder to operate at a temperature below 40° C., said adapter means further comprises an apertured collar, an apertured shaft and a locking pin for separating said adapter means into an upper portion and a lower portion, said upper portion being bolted to said chamber body and said lower portion being bolted to said lift cylinder.