Apparatus for holding and delayering a semiconductor die

A die holder for delayering a die, comprising, in combination:

• a) an inner member, said inner member having at least one surface;
• b) an outer member having an exteriorly open hole therein, said outer member having a surface around said hole, said hole having an exterior;
• c) said hole being large enough to removably receive said inner member entirely therein;
• d) said hole also being deep enough to provide for receiving said inner member in a position wherein said one surface of said inner member would be beneath the exterior of said hole at a depth substantially as deep as the thickness of the die, said die having a die surface, the highest point of the die surface being above the exterior of said hole;
• e) said members being configured to permit said inner member to move inwardly and outwardly through said hole;
• f) at least one positioner connected to at least one of said members for positioning said inner member relative to said hole, such that, when the die is attached to said one surface, the exposed to-be-delayed die surface is exposed at a predetermined increment just outside said hole;
• g) said predetermined increment subtending an exposure angle between the highest plane defined by the surface of said member around said hole and the highest point of said exposed to-be-delayed die surface above said plane;
• and
• h) said predetermined increment defining said exposure angle to be less than substantially two degrees.