Method to increase removal rate of oxide using fixed-abrasive
AssigneeInternational Business Machines Corporation
InventorsLaertis Economikos, Alexander Simpson
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AssigneeInternational Business Machines Corporation
InventorsLaertis Economikos, Alexander Simpson
Estimating the term…
The invention provides fixed-abrasive chemical-mechanical polishing processes which are effective in rapidly reducing thickness of oxide layers, especially siliceous oxides. The processes of the invention are preferably characterized by at least one step involving simultaneous use of a fixed-abrasive polishing element and an aqueous liquid medium containing an abrasive. Where the original oxide layer has topographic variation, the thickness reduction technique of the invention may be preceeded by topography reduction step using a fixed-abrasive and an aqueous medium containing a polyelectrolyte for at least a portion of the polishing process involving reduction in the amount of topographic variation (height differential) across the oxide layer on the substrate.
A method of reducing thickness of an oxide layer on a substrate by fixed-abrasive chemical-mechanical polishing, said method comprising:
A method of polishing an over-filled oxide topographic feature on a substrate by fixed-abrasive chemical-mechanical polishing, said method comprising:
Dependencies are inferred from the claim text.