Socket for pin grid array package

An electrical system comprising:

• first and second electronic packages of different sizes having corresponding arrays of pins;
• and
• a socket configured to receive said first and seconds electronic packages, said socket comprising a base having a top surface including an array of pin receiving chambers therein corresponding to said arrays of pins, said base having base side walls;
• and a cover having a top surface including an array of holes therethrough corresponding to said array of pin receiving chambers and said arrays of pins, said cover including cover side walls connected to said top surface, said cover and base side walls slidably engaging one another whereby said array of pins may be slid into and out of engagement with said array of pin receiving chambers, said socket further comprising first and second aligning surfaces provided on at least one of said base and cover, said first aligning surface being positioned to engage align said electronic package with said array of holes in said cover, said second aligning surface being positioned to engage and align an electronic package having a different size than said electronic package with said array of holes in said cover.

A socket for receiving electronic packages having first and second different sizes, comprising:

• a base housing having a top surface and base side walls, said top surface including an array of pin receiving chambers therein;
• a cover having a top surface including an array of holes therethrough corresponding to said array of pin receiving chambers, said cover including cover side walls connected to said top surface, said cover and base side walls slidably engaging one another;
• and
• a first locating member provided on said base housing, said first locating member being positioned to engage and align an electronic package having a first size with said array of holes in said cover.