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US 6,484,393 B1Granted
Method for wire bonding to flexible substrates
AssigneeAgilent Technologies, Inc.
InventorAlex B. Chan
Life of this patent
Estimating the term…
Abstract
A method of electrically connecting an electronic component to the flexible printed wiring board may comprise the steps of: Providing an air permeable platen having a substantially flat front surface and a back surface; placing the flexible printed wiring board on the front surface of the platen; lowering the pressure at the back surface of the platen; and electrically connecting the electronic component to the flexible printed wiring board.
Claims5
A method of electrically connecting an electronic component to a flexible printed wiring board, comprising the steps of:
- providing an air permeable platen within a base plate, said base plate comprising a plurality of apertures spaced around a perimeter of said air permeable platen;
- placing the flexible printed wiring board on a front surface of said air permeable platen and on a front surface of said base plate over said plurality of apertures;
- producing a lower pressure at a back surface of said air permeable platen than at the front surface of said air permeable platen and producing a vacuum pressure through said plurality of apertures in said base plate so that air pressure holds the flexible printed wiring board to the front surface of said air permeable platen and the front surface of said base plate;
- and
- electrically connecting the electronic component to the flexible printed wiring board.
2 more elements
Dependencies are inferred from the claim text.