Heat sink assembly

A method for securing a heat sink to a motherboard having an electronic device attached thereon, the motherboard defining a plurality of first through apertures, a back plate being attached below the motherboard, a plurality of bolts extending upwardly through the back plate and the first through apertures of the motherboard, the method comprising the steps of:

• a) providing a heat sink defining a plurality of second through apertures;
• b) providing a plurality of standoffs, each of the standoffs comprising a head and a body, the body comprising an expandable portion, a smooth guiding portion above the expandable portion and a threaded portion above the smooth guiding portion;
• c) providing a plurality of springs;
• d) placing the springs over the bodies of the standoffs;
• e) extending the bodies through the second through apertures such that the springs are located between the heads and heat sink;
• f) expanding the expandable portions to thereby combine the heat sink, the standoffs and the springs into a single unit;
• g) attaching the combined heat sink, standoffs and springs to the motherboard such that the bolts extend through the expandable portions to the smooth guiding portions, thereby guiding the bolts in the standoffs;
• and
• h) threading the standoffs to cause the bolts to engage in the threaded portions of the standoffs such that the springs are compressed to thereby firmly press the heat sink onto the electronic device.

A heat sink assembly for an electronic device comprising:

• a heat sink comprising a base defining a plurality of through apertures and adapted for contacting the electronic device, and a plurality of fins extending upwardly from the base;
• a plurality of standoffs each comprising a body extending through a corresponding through aperture, and a head formed on a top end of the body, the body comprising a hollow part spanning middle and bottom portions thereof, the hollow part comprising an expandable portion in a bottom end thereof, a smooth guiding portion above the expandable portion for guiding a corresponding bolt in the body and a threaded portion located above the smooth guiding portion for engaging with the corresponding bolt;
• and
• a plurality of springs compressed between the heads of the standoffs and the base, wherein
• when the expandable portions are expanded outwardly the standoffs are securely attached to the heat sink and the base is sandwiched between the expandable portions and the springs.

A heat sink assembly comprising:

• a heat sink comprising a base with a plurality of through apertures therein and a plurality of fins thereon;
• a plurality of hollow standoffs extending through said through apertures, respectively;
• a plurality of springs located on exteriors of the corresponding standoffs, respectively;
• expandable portions formed on bottom portions of the standoffs, respectively;
• wherein
• said expandable portions are outwardly expanded after downwardly inserted into and through the corresponding through apertures to have the base retainably sandwiched between the expandable portions and the corresponding springs.