Heat sink assembly with pressing wedges
AssigneeHon Hai Precision Ind. Co., Ltd.
InventorHung-Chi Yu
Life of this patent
Estimating the term…
Abstract
A heat sink assembly includes a mother board (70), a CPU (50), a pair of retention modules (40), a heat sink (30), and a fastener (20). The retention modules are secured to the mother board at opposite sides of the CPU. The heat sink is attached to the CPU. The fastener includes a spring (26), and a pair of wedges (22) engaged at opposite ends of the spring. The fastener engagingly spans across the heat sink. The spring provides the fastener with resiliency, and presses the wedges against the retention modules. The wedges are pressed by the retention modules toward the CPU, thereby pressing the heat sink against the CPU.
Claims20
A heat sink assembly comprising:
- a mother board;
- an electronic device mounted on the mother board;
- a pair of retention modules secured to the mother board and surrounding the electronic device, each of the retention modules having a top wall, the top wall defining a slanted plane on a bottom thereof;
- a heat sink attached to the electronic device, the heat sink having a base in contact with the electronic device and a plurality of fins extending from the base;
- and
- a fastener engaged with the heat sink and the retention modules, the fastener comprising a pair of wedges and an elastic element connecting between the wedges, each of the wedges having an inclined plane on a top thereof, the inclined plane being intimately engaged with the slanted plane of a corresponding retention module.
A heat sink assembly comprising:
- a mother board;
- an electronic device mounted on the mother board through a socket;
- a pair of retention modules secured to the mother board at opposite sides of the electronic device;
- a heat sink attached to a top of the electronic device;
- and
- a fastener engagingly spanning the heat sink, the fastener having opposite ends thereof engagingly sandwiched between the heat sink and the retention modules.
A heat sink assembly comprising:
- a mother board;
- a socket mounted on the mother board;
- an electronic component seated upon the socket;
- a pair of retention modules mounted on the mother board and about said socket and said electronic component;
- a heat sink seated upon the electronic component;
- a fastener seated upon the heat sink and having tendency to bring about a horizontal movement to have two opposite ends thereof abut against the corresponding retention modules, respectively, along a lengthwise direction of said fastener;
- and
- one guiding structure formed on each of said retention modules to initiate a downward movement of said fastener in response to said horizontal movement so as to result in a downward force to have the heat sink tightly downwardly abut against the electronic component for removing heat generated by said electronic component.
Dependencies are inferred from the claim text.