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US 6,480,385 B2Granted
Electronic assembly and cooling thereof
AssigneeIntel Corporation
InventorKrishna Seshan
Life of this patent
Estimating the term…
Abstract
An integrated circuit that includes a die having a circuit area and outer edges. A guard ring surrounds the circuit area within the outer edges of the die. The guard ring includes a projection that extends to at least one outer edge of the die to extract heat from the die that is generated during operation of the integrated circuit.
Claims18
An integrated circuit comprising:
- a die having a circuit area and outer edges;
- and
- a guard ring surrounding the circuit area within the outer edges of the die, the guard ring including a projection that extends to at least one of the outer edges of the die to extract heat from the die during operation of the integrated circuit.
An integrated circuit comprising:
- an electronic substrate;
- a die mounted on the electronic substrate, the die including a circuit area and outer edges;
- a guard ring encircling the circuit area, the guard ring including a projection that extends to at least one of the outer edges of the die to extract heat from the circuit area;
- and
- a clamp connecting the projection on the guard ring to the electronic substrate to extract heat from the guard ring during operation of the integrated circuit.
2 more elements
A computer system comprising:
- a die including a processor and outer edges;
- a guard ring surrounding the processor within the outer edges of the die, the guard ring including a projection that extends to at least one of the outer edges of the die to extract heat from the processor during operation of the computer system;
- and
- a display coupled to the processor.
1 more element
Dependencies are inferred from the claim text.