Electronic component cooling apparatus
AssigneeSanyo Denki Co., Ltd.
InventorsYuichi Kodaira, Haruhisa Maruyama, Naoko Ishiwatari
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AssigneeSanyo Denki Co., Ltd.
InventorsYuichi Kodaira, Haruhisa Maruyama, Naoko Ishiwatari
Estimating the term…
An electronic component cooling apparatus capable of firmly mounting a fan unit mounting frame on a heat sink without increasing mechanical strength of the fan unit mounting frame. The fan unit mounting frame includes a pair of mounting legs provided thereon with hooks, which are engaged with hook engagements provided on a base of the heat sink. A top plate of the fan unit mounting frame is provided thereon with projections acting as a first pivotal movement preventing engagement structure and fitted in gaps defined between adjacent radiation fins of a radiation fin unit. Also, the top plate is provided thereon with projections which are abutted against end surfaces of the radiation fins positioned in a second direction, to thereby act as a second pivotal movement preventing engagement structure for preventing pivotal movement of the top plate in the second direction.
An electronic component cooling apparatus comprising:
Dependencies are inferred from the claim text.