High performance air cooled heat sinks used in high density packaging applications

An electronic system, comprising:

• a printed circuit board having at least one integrated circuit device, wherein the integrated circuit device having a front side and a back side, and wherein the front side is mounted to the printed circuit board;
• a heat dissipation device comprising:
• a thermally conductive post, having substantially planar upper and lower surfaces, wherein the lower surface has a shape substantially similar to the back side of the integrated circuit device, wherein the lower surface is thermally coupled to the back side of the integrated circuit device;
• and
• a conductive heat exchange portion extends upwardly from the upper surface of the post such that the heat exchange portion and the post allow clearance for components mounted on the printed circuit board to be in close proximity to the integrated circuit device, the heat exchange portion has a chamber within to receive an air movement device constructed and arranged for moving air in, around, over, and out the chamber to enhance heat dissipation from the heat dissipation device.

A method of forming a heat dissipation device to extract heat from an integrated circuit device attached to a printed circuit board surrounded by other components, comprising:

• forming a thermally conductive post including substantially planar upper and lower surfaces, wherein the upper surface is disposed across from the lower surface, wherein the lower surface is adapted to thermally contact the integrated circuit device;
• forming a heat exchange portion including an array of fins and a through hole substantially in the middle of the heat exchange portion and wherein the through hole has an axis that is substantially parallel to the array of fins;
• forming a chamber within the heat exchange portion including the array and the through hole to receive and house an air movement device so that the air movement created by the air movement device enhances the heat dissipation from the device;
• and
• thermally coupling the post to the through hole in the heat exchange portion such that the upper surface of the post is in close proximity to the chamber and further the heat exchange portion including the array extends upwardly from the upper surface of the post such that the integrated circuit device and the post including the array are in close proximity and do not interfere with the other components mounted on the printed circuit board.