Socket activation interlock

A method to disassemble a component and heat dissipation/attachment device from a socket on a substrate using an activation interlock, comprising:

• disengaging said heat dissipation/attachment device from said substrate;
• opening said socket;
• and
• removing said component from said socket, wherein said activation interlock prevents said opening of said socket until after disengaging said heat dissipation/attachment device from said substrate.

An assembled substrate with an activation interlock to limit operator ability to open and close a socket holding a component, relative to the engagement and disengagement of a heat dissipation/attachment device attached to said component, comprising:

• a substrate;
• a socket mounted on said substrate, including a socket control to open or close said socket;
• a component inserted in said socket;
• and
• a heat dissipation/attachment device attached by one or more retention hardware pieces to said substrate, wherein said heat dissipation/attachment device includes an activation interlock to limit operator access to said socket control.

An assembled substrate that limits operator ability to open and close a socket holding a component relative to the engagement and disengagement of a heat dissipation/attachment device attached to said component, comprising:

• a substrate;
• a socket mounted on said substrate, including a socket control to open or close said socket;
• a component inserted in said socket;
• a heat dissipation/attachment device attached to said component and separately attached to said substrate;
• and
• an activation interlock that prevents operation of said socket control when said heat dissipation/attachment device is attached to said substrate.