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US 6,477,047 B1Granted
Temperature sensor mounting for accurate measurement and durability
AssigneeAdvanced Micro Devices, Inc.
InventorsDoug Markwardt, Thomas P. Dolbear, Lewis M. Eyman
Life of this patent
Estimating the term…
Abstract
A temperature sensor for an integrated circuit is attached to a heat sink using a compliant member such as a spring. The spring attaches to the heat sink and extends across a slot in the thermal contact surface of the heat sink so that the temperature sensor coupled to the spring is centered nominally over an integrated circuit die when the heat sink is abutted against the integrated circuit.
Claims25
An apparatus comprising:
- a heatsink having a thermal contact surface, the heatsink including a recessed portion in the thermal contact surface;
- a compliant member coupled to the heatsink, at least a portion of the compliant member being displaceable within the recessed portion in response to a compressive force;
- a temperature sensor, the compliant member exerting a force on the temperature sensor to ensure engagement of the temperature sensor with a semiconductor device when the thermal contact surface is abutted against the semiconductor device;
- and
- wherein the recessed portion is a slot extending to an edge of the thermal contact surface and the compliant member and the temperature sensor extend within the slot placed in the heatsink to nominally center the temperature sensor over a semiconductor device when the thermal contact surface is abutted against the semiconductor device.
2 more elements
An apparatus comprising:
- a heatsink having a thermal contact surface, the heatsink including a recessed portion in the thermal contact surface;
- a compliant member coupled to the heatsink, at least a portion of the compliant member being displaceable within the recessed portion in response to a compressive force;
- a temperature sensor, the compliant member exerting a force on the temperature sensor to ensure engagement of the temperature sensor with a semiconductor device when the thermal contact surface is abutted against the semiconductor device;
- and wherein the compliant member is a spring mounted to a side of the heatsink.
1 more element
An apparatus comprising:
- a heatsink;
- a temperature sensor for sensing temperature of a semiconductor device;
- and
- means coupled to an outer side of the heatsink, normal to a heat transfer surface, for keeping the temperature sensor abutted against the semiconductor device.
1 more element
A heatsink comprising:
- a base portion including a surface portion for thermal engagement with a semiconductor device;
- a wiring channel formed in a second surface of the base portion, the second surface being opposite the surface portion for thermal engagement, thereby allowing a thermal electric cooler (TEC) to be mounted flush against the second surface of the base portion;
- and
- wherein the base portion includes a recessed area in the surface portion to allow for displacement for a temperature sensor when the base portion is thermally engaged with the semiconductor device;
- and wherein the recessed area is a slot extending to an edge of the surface portion.
2 more elements
An apparatus comprising:
- a heatsink having a thermal contact surface, the heatsink including a recessed portion in the thermal contact surface;
- a compliant member disposed in the recessed portion, the compliant member being displaceable within the recessed portion in response to a compressive force;
- and
- a temperature sensor, the compliant member exerting a force on the temperature sensor to ensure engagement of the temperature sensor with a semiconductor device when the thermal contact surface is abutted against the semiconductor device;
- and wherein the compliant member is formed of high temperature silicone.
2 more elements
A method comprising:
- forming a recess in a thermal contact surface of a heatsink;
- securing a compliant member to the heatsink such that the compliant member is displaceable within the recessed portion in response to a compressive force, wherein the compliant member is formed of high temperature silicone;
- and
- causing the compliant member to act upon a temperature sensor to cause the engagement of the temperature sensor with a semiconductor device when the thermal contact surface is abutted against the semiconductor device.
1 more element
Dependencies are inferred from the claim text.