Heat sink dissipator for adapting to thickness change of a combination of a CPU and a CPU carrier
AssigneeMalico Inc.
InventorRobert Liang
Life of this patent
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AssigneeMalico Inc.
InventorRobert Liang
Estimating the term…
A heat sink dissipater includes a retaining device and a heat dissipater. A plurality of fins and a plurality of pads or recesses are integrally formed on the top surface of the heat dissipater. A plurality of resilient legs extend inward from the sides of the retaining device. Retaining edges are also formed on two sides of the retaining device. The resilient legs fall into the gaps between the fins when the retaining device is positioned on the heat dissipater to secure a CPU assembly. In an orientation, the legs are placed on the pads or recesses of the heat dissipater and in an orthogonal orientation, the legs are placed directly on the top surface of the heat dissipater. Therefore, CPU assemblies of different thickness can be accommodated by rotating the retaining device or the heat dissipater 90 degrees.
A heat sink dissipater, comprising:
A heat sink dissipater, comprising:
Dependencies are inferred from the claim text.