Press-fit IC power package and method therefor

An IC power package of an ac generator rectifier bridge, the package comprising:

• an electrically-conductive base having an axis, a circular-shaped perimeter circumscribing the axis, and an axial surface;
• a MOSFET die mounted to the axial surface of the base, the die having a first surface and an oppositely-disposed second surface, a drain region, a drain contact on the second surface and electrically-connected to the drain region, a source region, a source contact on the first surface and electrically-connected to the source region, a gate region, and a gate contact on the first surface and electrically-connected to the gate region, the drain contact being electrically connected to the base;
• an electrically-conductive pin mounted to the die and electrically connected to the source contact, the pin substantially coinciding with the axis of the base;
• an electrically-conductive member electrically connected to the gate contact;
• an electrically-insulative sleeve mounted to the base and surrounding the die, a limited portion of the pin, and a limited portion of the electrically-conductive member;
• and
• an encapsulation material within the sleeve that encapsulates the die and the portion of the pin within the sleeve.

An IC power package of an ac generator rectifier bridge, the package comprising:

• an electrically-conductive base having an axis, a circular-shaped perimeter circumscribing the axis, and an axial surface;
• a MOSFET die mounted to the axial surface of the base, the die having a first surface and an oppositely-disposed second surface, a drain region, a drain contact on the second surface and electrically-connected to the drain region, a source region, a source contact on the first surface and electrically-connected to the source region, a gate region, and a gate contact on the first surface and electrically-connected to the gate region, the drain contact being electrically connected to the base;
• an electrically-conductive pin mounted to the die and electrically connected to the source contact, the pin substantially coinciding with the axis of the base;
• an electrically-insulative sleeve mounted to the base and surrounding the die and a limited portion of the pin;
• an electrically-conductive ring mounted to the sleeve and surrounding the pin, the sleeve separating and electrically insulating the ring from the base;
• a bond wire electrically connecting the ring to the gate contact;
• and
• an encapsulation material within the sleeve that encapsulates the die, the limited portion of the pin, and the bond wire within the sleeve.

An IC power packaging method comprising the steps of:

• providing an electrically-conductive base;
• mounting a MOSFET die mounted to the base, the die having a drain region, a source region and a gate region, the drain region being electrically connected to the base;
• mounting an electrically-conductive pin to the die so as to be electrically connected to the source region and centrally-disposed along an axis of the base;
• and
• electrically connecting an electrically-conductive member to the gate region.

A method of packaging an IC power package for an ac generator rectifier bridge, the method comprising the steps of:

• forming an electrically-conductive base having an axis, a circular-shaped perimeter circumscribing the axis, and an axial surface;
• mounting a MOSFET die to the axial surface of the base, the die having a first surface and an oppositely-disposed second surface, a drain region, a drain contact on the second surface and electrically-connected to the drain region, a source region, a source contact on the first surface and electrically-connected to the source region, a gate region, and a gate contact on the first surface and electrically-connected to the gate region, the die being mounted to the base so that the drain contact is electrically connected to the base;
• mounting an electrically-conductive pin to the die so as to be electrically connected to the source contact, the pin being mounted so as to substantially coincide with the axis of the base;
• mounting an electrically-insulative sleeve to the base so as to surround the die and a limited portion of the pin;
• mounting an electrically-conductive ring to the sleeve so as to surround the pin and so that the sleeve separates and electrically insulates the ring from the base;
• electrically connecting the ring to the gate contact with a bond wire;
• and
• depositing an encapsulation material within the sleeve to encapsulates the die, the limited portion of the pin, and the bond wire within the sleeve.