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AssigneeIdemitsu Petrochemical Co., Ltd.
InventorsTomoyoshi Murakami, Yutaka Tsubokura, Shigemasa Suzuki, Satoru Kinouchi
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Provided is a polyarylene sulfide resin composition for sealing electronic parts, which comprises (A) from 20 to 35% by weight of a polyarylene sulfide resin, (B) from 60 to 75% by weight of silica, and (C) from 1 to 10% by weight of an elastomer, and contains (D) from 0.05 to 1.2 parts by weight of an epoxysilane and/or (E) from 0.1 to 3 parts by weight of an epoxy resin, both relative to 100 parts by weight of the total amount of the components (A), (B) and (C). The composition has good PCT and TCT acceptable quality and good fluidity, naturally having good properties intrinsic to ordinary PAS resin, and which, when used for sealing electronic parts, causes neither deformation of bonding wires and other elements nor package breakdown, and is therefore favorable to materials for sealing electronic parts.
A polyarylene sulfide resin composition for sealing electronic parts, which comprises (A) from 20 to 35% by weight of a polyarylene sulfide resin, (B) from 60 to 75% by weight of silica, and (C) from 1 to 10% by weight of an elastomer, and further contains (D) from 0.05 to 1.2 parts by weight, relative to 100 parts by weight of the total amount of the components (A), (B) and (C), of an epoxysilane.
A polyarylene sulfide resin composition for sealing electronic parts, which comprises (A) from 20 to 35% by weight of a polyarylene sulfide resin, (B) from 60 to 75% by weight of silica, and (C) from 1 to 10% by weight of an elastomer, and further contains (E) from 0.1 to 3 parts by weight, relative to 100 parts by weight of the total amount of the components (A), (B) and (C), of an epoxy resin.
A polyarylene sulfide resin composition for sealing electronic parts, which comprises (A) from 20 to 35% by weight of a polyarylene sulfide resin, (B) from 60 to 75% by weight of silica, and (C) from 1 to 10% by weight of an elastomer, and further contains (D) from 0.05 to 1.2 parts by weight of an epoxysilane and (E) from 0.1 to 3 parts by weight of an epoxy resin, both relative to 100 parts by weight of the total amount of the components (A), (B) and (C).
The polyarylene sulfide resin composition for sealing electronic parts as claimed, wherein the elastomer (C) is an ethylenic copolymer of ethylene, an alkyl α,β-unsaturated carboxylate, and maleic anhydride, with the repetitive units being from 50 to 90% by weight, from 5 to 49% by weight, and from 0.5 to 10% by weight, respectively.
A method for sealing electronic parts with a polyarylene sulfide resin composition, comprising contacting an electronic part with the polyarylene sulfide resin composition, wherein the polyarylene sulfide resin composition comprises (A) from 20 to 35% by weight of a polyarylene sulfide resin, (B) from 60 to 75% by weight of silica, and (C) from 1 to 10% by weight of an elastomer, and further contains (D) from 0.05 to 1.2 parts by weight, relative to 100 parts by weight of the total amount of the components (A), (B) and (C), or an epoxysilane.
A method for sealing electronic parts with a polyarylene sulfide resin composition, comprising contacting an electronic part with the polyarylene sulfide resin composition, wherein the polyarylene sulfide resin composition comprises (A) from 20 to 35% by weight of a polyarylene sulfide resin, (B) from 60 to 75% by weight of silica, and (C) from 1 to 10% by weight of an elastomer, and further contains (E) from 0.1 to 3 parts by weight, relative to 100 parts by weight of the total amount of the components (A), (B) and (C), of an epoxy resin.
A method for sealing electronic parts with a polyarylene sulfide resin composition, comprising contacting an electronic part with the polyarylene sulfide resin composition, wherein the polyarylene sulfide resin composition comprises (A) from 20 to 35% by weight of a polyarylene sulfide resin, (B) from 60 to 75% by weight of silica, and (C) from 1 to 10% by weight of an elastomer, and further contains (D) from 0.05 to 1.2 parts by weight of an epoxysilane and (E) from 0.1 to 3 parts by weight of an epoxy resin, both relative to 100 parts by weight of the total amount of the components (A), (B) and (C).
Dependencies are inferred from the claim text.