Dry thermal grease
AssigneeAOS Thermal Compounds
InventorPrakash Khatri
Life of this patent
Estimating the term…
Abstract
A heat sink material for use in electronic assemblies is disclosed. The heat sink material is a thermal grease that due its composition is dry to the touch and thus eliminates the problems associated with thermal greases in electronic assemblies.
Claims36
A method for providing a thermal interface material to an electronic component assembly, comprising the following steps:
- a) providing a heat generating electronic component with a first mounting surface;
- b) providing a second mounting surface on a heat dissipating component upon which the first mounting surface of the heat generating electronic component is to be mounted;
- and
- c) disposing dry thermal grease between the first mounting surface of the heat generating electronic component and the second mounting surface of the heat dissipating component to effectuate heat transfer therebetween,
- wherein the dry thermal grease includes
- a heat sink compound pre-blend made up of Polyol Ester and an Antioxidant,
- high viscosity oil,
- Zinc Oxide Powder as a filler,
- polyglycolether as a surfactant,
- a Polystyrene based polymer, and
- Naptha as a solvent.
A method for providing a thermal interface material to an electronic component assembly, comprising the following steps:
- a) providing a heat generating electronic component with a first mounting surface;
- b) providing a second mounting surface on a heat dissipating component upon which the first mounting surface of the heat generating electronic component is to be mounted;
- and
- c) disposing dry thermal grease between the first mounting surface of the heat generating electronic component and the second mounting surface of the heat dissipating component to effectuate heat transfer therebetween,
- wherein the dry thermal grease includes a heat sink compound pre-blend made up of Polyol Ester and an antioxidant,
- high viscosity oil,
- Zinc Oxide and Magnesium Oxide as a filler material, and
- aluminum silicate.
A method for applying a thermal interface material, comprising the following steps:
- a) providing a heat generating component with a first surface;
- b) providing a heat dissipating component with a first surface;
- and
- c) disposing dry thermal grease between the first surfaces to effectuate heat transfer therebetween,
- wherein the dry thermal grease includes a pre-blend compound made up of Polyol Ester and an Antioxidant, as well as a high viscosity oil, a Zinc Oxide Powder as a filler, a polyglycolether as a surfactant, a Polystyrene based polymer, and Naptha as a solvent,
- wherein the pre-blend compound is 9% by weight of the dry thermal grease,
- wherein the high viscosity oil is 5% by weight of the dry thermal grease,
- wherein the Zinc Oxide Powder is 72.8% by weight of the dry thermal grease,
- wherein the polyglycolether is 0.2% by weight of the dry thermal grease,
- wherein the Polystyrene based polymer is, 3% by weight of the dry thermal grease, and
- wherein the Naptha is 1% by weight of the dry thermal grease.
A method for providing a thermal interface material to an electronic component assembly, consisting of the following steps:
- a) providing a heat generating electronic component with a first mounting surface;
- b) providing a second mounting surface on a heat dissipating component upon which the first mounting surface of the heat generating electronic component is to be mounted;
- and
- c) disposing dry thermal grease between the first mounting surface of the heat generating electronic component and the second mounting surface of the heat dissipating component to effectuate heat transfer therebetween,
- wherein the dry thermal grease includes
- a heat sink pre-blend compound made up of Polyol Ester and an Antioxidant, as well as a high viscosity oil, a Zinc Oxide Powder as a filler, a polyglycolether as a surfactant, a Polystyrene based polymer, and Naptha as a solvent.
A method for applying a thermal interface material, consisting of the following steps:
- a) providing a heat generating component with a first surface;
- b) providing a heat dissipating component with a first surface;
- and
- c) disposing dry thermal grease between the first surfaces to effectuate heat transfer therebetween,
- wherein the dry thermal grease includes a pre-blend compound made up of Polyol Ester and an Antioxidant, as well as a high viscosity oil, a Zinc Oxide Powder as a filler, a polyglycolether as a surfactant, a Polystyreme based polymer, and Naptha as a solvent,
- wherein the pre-blend compound is 9% by weight of the dry thermal grease,
- wherein the high viscosity oil is 5% by weight of the dry thermal grease,
- wherein the Zinc Oxide Powder is 72.8% by weight of the dry thermal grease,
- wherein the polyglycolether is 0.2% by weight of the dry thermal grease,
- wherein the Polystyrene based polymer is 3% by weight of the dry thermal grease, and
- wherein the Naptha is 1% by weight of the dry thermal grease.
A method for applying a thermal interface material, comprising the following steps:
- a) providing a heat generating component with a first surface;
- b) providing a heat dissipating component with a first surface;
- and
- c) disposing dry thermal grease between the first surfaces to effectuate heat transfer therebetween,
- wherein the dry thermal grease includes a pre-blend compound made up of Polyol Ester and an antioxidant, as well as a high viscosity oil, a Zinc Oxide and a Magnesium Oxide as a filler material, and an aluminum silicate,
- wherein the pre-blend compound is 11.2% by weight of the dry thermal grease,
- wherein the high viscosity oil is 2.5% by weight of the dry thermal grease,
- wherein the Zinc Oxide powder is 20.1% by weight of the dry thermal grease, and the Magnesium Oxide powder is 60.9% by weight of the dry thermal grease, and
- wherein the aluminum silicate is 5.2% by weight of the dry thermal grease.
A method for providing a thermal interface material to an electronic component assembly, consisting of the following steps:
- a) providing a heat generating electronic component with a first mounting surface;
- b) providing a second mounting surface on a heat dissipating component upon which the first mounting surface of the heat generating electronic component is to be mounted;
- and
- c) disposing dry thermal grease between the first Mounting surface of the heat generating electronic component and the second mounting surface of the heat dissipating component to effectuate heat transfer therebetween,
- wherein the dry thermal grease includes a heat sink pre-blend compound made up of Polyol Ester and an antioxidant, as well as a high viscosity oil, a Zinc Oxide and a Magnesium Oxide as a filler material, and an aluminum silicate.
A method for applying a thermal interface material, consisting of the following steps:
- a) providing a heat generating component with a first surface;
- b) providing a heat dissipating component with a first surface;
- and
- c) disposing dry thermal grease between the first surfaces to effectuate heat transfer therebetween,
- wherein the dry thermal grease includes a pre-blend compound made up of Polyol Ester and an antioxidant, as well as a high viscosity oil, a Zinc Oxide and a Magnesium Oxide as a filler material, and an aluminum silicate,
- wherein the pre-blend compound is 11.2% by weight of the dry thermal grease.
- wherein the high viscosity oil is 2.5% by weight of the dry thermal grease,
- wherein the Zinc Oxide Power is 20.1% by weight of the dry thermal grease and the Magnesium Oxide powder is 60.9% by weight of the dry thermal grease, and
- wherein the aluminum silicate is 5.2% by weight of the dry thermal grease.
Dependencies are inferred from the claim text.