Method of fabricating integrated circuits, providing improved so-called saw bows

A method of fabricating integrated circuits (2, 3, 4, 5, 6, 7, 8, 9, 10), in which a reticular pattern (11) of separation strips (12, 13, 14, 15) on the semiconductor wafer (1) is defined, and in which a plurality of juxtaposed integrated circuit configurations (16) are formed between the separation strips (12, 13, 14, 15) on the semiconductor wafer (1), and in which during the fabrication of the integrated circuits (2, 3, 4, 5, 6, 7, 8, 9, 10) at least one conductor track (33, 37;

• 65) required for test purposes is formed for each integrated circuit (2, 3, 4, 5, 6, 7, 8, 9, 10), which conductor track (33, 37;
• 65) has two conductor track sections (34, 35, 38, 39;
• 66, 67), which two conductor track sections (34, 35, 38, 39;
• 66, 67) issue from the relevant integrated circuit configuration (16) and each extend at least into a separation strip (15, 14;
• 12, 15) and are connected to one another in an electrically conductive manner in the areas of their ends which are remote from the integrated circuit configuration (16), and which conductor track (33, 37;
• 65) serves for the application of a useful signal utilized for test purposes, and in which during the fabrication of the integrated circuits (2, 3, 4, 5, 6, 7, 8, 9, 10) for each integrated circuit (2, 3, 4, 5, 6, 7, 8, 9, 10) at least one additional conductor track section (41, 42;
• 71) is formed adjacent a conductor track section (34, 35, 38, 39;
• 66, 67), which additional conductor track section issues from the relevant integrated circuit configuration (16) and extends toward a separation strip (15, 14;
• 15) and serves for applying a spurious signal (BR2) which interferes with testing, and in which after the fabrication of the integrated circuits (2, 3, 4, 5, 6, 7, 8, 9, 10) on the semiconductor wafer (1) the semiconductor wafer (1) is partitioned into semiconductor dice (43, 44, 45, 46, 47, 48, 49, 50, 51) along the separation strips (12, 13, 14, 15), during which the conductor tracks (33, 37;
• 65) are severed.