US 6,475,702 B2Granted

Photosensitive resin composition and photoresist ink for manufacturing printed wiring boards

AssigneeGoo Chemical Co., Ltd.

InventorToshio Morigaki

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Abstract

A photosensitive resin composition developable with water or a diluted alkali solution comprises the following components (A) to (D). That is, the component (A) is a water-soluble photosensitive resin selected from the group consisting of a first resin obtained by introducing a styryl pyridinium group into a polyvinyl alcohol polymer, a second resin obtained by introducing a styryl quinolinium group into the polyvinyl alcohol polymer, and a third resin obtained by adding N-alkylol(meth)acrylamide to the polyvinyl alcohol polymer. The component (B) is a photosensitive prepolymer having a carboxyl group and at least two ethylenically unsaturated groups in molecule. The component (C) is a photopolymerization initiator. The component (D) is water. The photosensitive resin composition will be preferably used as a photoresist ink for manufacturing printed wiring boards.

Claims9

Dependent claims

A photosensitive resin composition developable with a diluted alkali aqueous solution comprising:

(A) a water-soluble photosensitive resin selected from the group consisting of a first resin obtained by introducing a styryl pyridinium group into a polyvinyl alcohol polymer, a second resin obtained by introducing a styryl quinolinium group into a polyvinyl alcohol polymer, and a third resin obtained by adding N-alkylol (meth) acrylamide to a polyvinyl alcohol polymer;
(B) a photosensitive prepolymer having a carboxyl group and at least two photopolymerizable ethylenically unsaturated groups in the molecule;
(C) a photopylymerization initiator;
and
(D) water,
wherein a compounding amount of said water-soluble photosensitive resin (A) is in a range of 0.1 to 50 weight % with respect to the total amount of all components of said photosensitive resin composition excluding the amount of water, and a compounding amount of said photosensitive polymer (B) is in a range of 30 weight % or more with respect to the total amount of all components of said photosensitive resin composition excluding the amount of water.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application: 09/928,307Filed 14 Aug 2001 · continuation
Priority: JP 10-6160512 Mar 1998
Published: US 2002/0022194 A121 Feb 2002
Granted: 5 Nov 2002
Term ends: Not estimatedThe source records don’t support an estimate.

Classification2 codes

G03F 7/033
With binders: the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
G03F
Photomechanical production of textured or patterned surfaces

Family

Application09/265,571Parent of this division · filed 10 Mar 1999
Application09/584,492Parent of this continuation · filed 1 Jun 2000
US 2002/0022194 A1Pre-grant publication · published 21 Feb 2002
Application09/584,492Parent of this division
US 6,136,507 AParent of this division
US 6,322,952 B1Related patent
US 6,475,702 B2This patent

From the US filing history. Foreign family members aren’t listed.