Positively photosensitive resin composition

Abstract

A positive-working radiation-sensitive resin composition showing a good throughput upon production of semiconductors or the like and less process dependence of dimensional accuracy as well as having high sensitivity and high resolution, and being able to form a pattern with good shape and a high aspect ratio. The positive-working radiation-sensitive resin composition comprises (i) a radiation-sensitive novolak resin comprising a reaction product between an alkali-soluble novolak resin from which low-molecular-weight components have been removed by fractional treatment and an o-naphthoquinonediazide compound, or a product obtained by removing low-molecular-weight components by fractional treatment from a reaction product between an alkali-soluble novolak resin and an o-naphthoquinonediazide compound, and (ii) a low-molecular compound represented by the general formula (I) and having phenolic hydroxyl group or groups: wherein R1, R2, R3, R4, R5, R6 and R7 each represents independently H, a C1 to C4 alkyl group, a C1 to C4 alkoxyl group, a cyclohexyl group or a group represented by the formula: wherein R8 represents H, a C1 to C4 alkyl group, a C1 to C4 alkoxyl group or a cyclohexyl group; each of m and n is 0, 1 or 2; each of a, b, c, d, e, f, g and h is 0 or an integer of 1 to 5 satisfying a+b≦5, c+d≦5, e+f≦5, and g+h≦5; and i is 0, 1 or 2.

Dependencies are inferred from the claim text.