Radiation-sensitive compositions for printing plates for improving their chemical and developer resistance and printing plates comprising such compositions

A method for the preparation of a radiation-sensitive composition comprising mixing at least one novolak, at least one naphthoquinone diazide derivative and a copolymer consisting of the units A, B and C wherein unit A is present in an amount of 5 to a maximum of 50 mol % and has the following formula:

• wherein R1 and R4 are selected such that the homopolymer of A is alkali-soluble, unit B is present in an amount of 20-70 mol % and has the following formula:
• wherein R2, R6 and R7 are selected such that the homopolymer of B has a glass transition temperature above 100° C.,
• and unit C is present in an amount of 10-50 mol % and has the following formula:
• wherein R3 and R5 are selected such that the homopolymer of C is water-soluble, with the proviso that unit C is different from unit A and subsequently dissolving the solids components in an organic solvent.

A printing plate comprising a substrate and a radiation-sensitive composition applied to the substrate wherein the radiation-sensitive composition comprises a copolymer consisting of the units A, B and C wherein unit A is present in an amount of 5 to a maximum of 50 mol % and has the following formula:

• wherein R1 and R4 are selected such that the homopolymer of A is alkali-soluble, unit B is present in an amount of 20-70 mol % and has the following formula:
• wherein R2, R6 and R7 are selected such that the homopolymer of B has a glass transition temperature above 100° C.,
• and unit C is present in an amount of 10-50 mol % and has the following formula:
• wherein R3 and R5 are selected such that the homopolymer of C is water-soluble, with the proviso that unit C is different from unit A.

A method for producing a printing plate comprising:

• (a) providing a substrate and optionally subjecting the substrate to a pre-treatment;
• (b) preparing a solution of a radiation-sensitive composition in an organic solvent, wherein the radiation-sensitive composition comprises a copolymer consisting of the units A, B and C wherein unit A is present in an amount of 5 to a maximum of 50 mol % and has the following formula:
• wherein R1 and R4 are selected such that the homopolymer of A is alkali-soluble, unit B is present in an amount of 20-70 mol % and has the following formula:
• wherein R2, R6 and R7 are selected such that the homopolymer of B has a glass transition temperature above 100° C.,
• and unit C is present in an amount of 10-50 mol % and has the following formula:
• wherein R3 and R5 are selected such that the homopolymer of C is water-soluble, with the proviso that unit C is different from unit A.
• (c) applying the solution prepared in step (b) to the substrate;
• and
• (d) drying the substrate.

A printed circuit board comprising a substrate and a radiation-sensitive composition applied to the substrate wherein the radiation-sensitive composition comprises a copolymer consisting of the units A, B and C wherein unit A is present in an amount of 5 to a maximum of 50 mol % and has the following formula:

• wherein R1 and R4 are selected such that the homopolymer of A is alkali-soluble, unit B is present in an amount of 20-70 mol % and has the following formula:
• wherein R2, R6 and R7 are selected such that the homopolymer of B has a glass transition temperature above 100° C.,
• and unit C is present in an amount of 10-50 mol % and has the following formula:
• wherein R3 and R5 are selected such that the homopolymer of C is water-soluble, with the proviso that unit C is different from unit A.

A photomask comprising a substrate and a radiation-sensitive composition applied to the substrate wherein the radiation-sensitive composition comprises a copolymer consisting of the units A, B and C wherein unit A is present in an amount of 5 to a maximum of 50 mol % and has the following formula:

• wherein R1 and R4 are selected such that the homopolymer of A is alkali-soluble, unit B is present in an amount of 20-70 mol % and has the following formula:
• wherein R2, R6 and R7 are selected such that the homopolymer of B has a glass transition temperature above 100° C.,
• and unit C is present in an amount of 10-50 mol % and has the following formula:
• wherein R3 and R5 are selected such that the homopolymer of C is water-soluble, with the proviso that unit C is different from unit A.