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US 6,475,407 B2Granted
Composition for polishing metal on semiconductor wafer and method of using same
AssigneeShowa Denko K.K.
InventorFumiyoshi Ono
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Abstract
A slurry for polishing a metal film of a semiconductor device, comprising alumina-type fine particles having specific properties and composition, a polishing accelerator and water.
Claims5
A polishing composition for polishing a metal film on a semiconductor substrate, comprising alumina-type fine particles containing or not containing hydrate, a polishing accelerator and water, said alumina-type fine particles having an α conversion ratio of from 68 to 90% and a specific surface area of from 31 to 77 m2/g.
Dependencies are inferred from the claim text.