Photoresist stripping method
AssigneeShipley Company, L.L.C.
InventorJavad J. Sahbari
Life of this patent
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Abstract
A method for removing photoresist, probing ink and wafer bonding adhesive from a substrate using one or more (C6-C16)olefins, one ore more (C1-C6)alkoxybenzenes, and one ore more organic sulfonic acid compounds is provided.
Claims13
A method for manufacturing electronic devices comprising the steps of disposing a photoresist on a substrate to form a photoresist layer, exposing the photoresist layer through a photomask to a source of activating radiation, developing the photoresist layer to produce a pattern, etching the photoresist to transfer the pattern to the substrate, and removing the photoresist layer, wherein the photoresist layer is removed by contacting the photoresist with a composition comprising one or more (C6-C16)olefins, one or more (C1-C6)alkoxybenzenes, and one or more organic sulfonic acid compounds.
A method for removing material selected from photoresist, probing ink or wafer bonding adhesive from a substrate comprising the step of contacting the material with a composition comprising one or more (C6-C16)olefins, one or more (C1-C6)alkoxybenzenes, and one or more organic sulfonic acid compounds.
Dependencies are inferred from the claim text.