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US 6,475,272 B1Granted
Chemical solution for Cu-Ca-O thin film formations on Cu surfaces
AssigneeAdvanced Micro Devices, Inc.
InventorSergey Lopatin
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AssigneeAdvanced Micro Devices, Inc.
InventorSergey Lopatin
Estimating the term…
A nontoxic aqueous chemical solution for forming a Cu—Ca—O thin film on a Cu surface. Specifically, the present invention chemical solution is used to form a thin film which reduces electromigration in Cu interconnect lines by decreasing the drift velocity therein which decreases the Cu migration rate in addition to void formation rate. More specifically, the present invention provides a unique chemical solution for forming a copper-calcium-oxide (Cu—Ca—O) thin film on a copper (Cu) surface, comprising: (a) at least one calcium (Ca) ion source for providing a plurality of Ca ions; (b) at least one complexing agent for complexing the plurality of Ca ions; (c) at least one copper (Cu) ion source for providing a plurality of Cu ions; (d) at least one complexing agent for complexing the plurality of Cu ions; (e) at least one pH adjuster; (f) at least one reducing agent for facilitating deposition of the plurality of Cu ions; (g) at least one wetting agent for stabilizing the chemical solution; and (h) a volume of water, (a) through (g) being dissolved in (h). The Cu surface may be immersed in the chemical solution for forming the Cu—Ca—O thin film. By forming the Cu—Ca—O thin film, the present invention improves interconnect reliability, enhances electromigration resistance, and improves corrosion resistance.
A chemical solution for forming a copper-calcium-oxide thin film on a copper surface, comprising:
A method of forming a copper-calcium-oxide thin film on a copper surface by synthesizing a chemical solution and treating the copper surface in the chemical solution, comprising:
A method of synthesizing a chemical solution for forming a copper-calcium-oxide thin film on a copper surface, comprising:
Dependencies are inferred from the claim text.