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US 6,474,986 B2Granted
Hot plate cooling method and heat processing apparatus
AssigneeTokyo Electron Limited
InventorsTetsuya Oda, Mitsuhiro Tanoue, Toshichika Takei, Eiichi Shirakawa
Life of this patent
Estimating the term…
Abstract
In a heat processing apparatus structured to heat a wafer on a hot plate, a black plate at least the rear face of which practically has a color with a JIS lightness of 0V to 4V is positioned above the hot plate. Moreover, cooling air is blown out from nozzles onto the rear face of the hot plate. Thus, the temperature of the hot plate can be cooled rapidly.
Claims33
A method for processing a substrate, comprising the steps of:
- heating a hot plate for placing the substrate thereon and heating the substrate;
- and
- positioning an object of which a portion facing the hot plate has a color with good heat absorption efficiency above the hot plate.
A heat processing apparatus, comprising:
- a hot plate for heating a substrate;
- a heater disposed to be integrated structurally with the hot plate and;
- a nozzle for blowing a cooling gas onto a rear face of the hot plate.
An apparatus for performing heat processing for a substrate, comprising:
- a plate for holding the substrate;
- a heater for heating the plate;
- a cooling container containing a refrigerant;
- a cooling module, disposed to touch at least one face of the cooling container, for absorbing a heat from the cooling container to cool the refrigerant in the cooling container to a predetermined temperature by a Peltier effect;
- a supply source of a cooling gas;
- a cooling gas channel connected to the supply source, a portion of which is provided to touch the refrigerant in the cooling container and cooled by touching the refrigerant;
- and
- a nozzle for jetting the cooling gas which has passed through the cooling gas channel toward the plate.
5 more elements
An apparatus for forming a resist pattern on a substrate, comprising:
- a coating processing unit for coating a front face of the substrate with a resist;
- a developing processing unit for supplying a developing solution to the front face of the substrate subjected to exposure to develop the same;
- a heat processing unit for heating the substrate after exposure to a predetermined temperature;
- and
- a substrate carrier for transferring the substrate between the coating processing unit, the developing processing unit, and the heat processing unit,
- the heat processing unit, comprising:
- a plate for holding the substrate;
- a heater for heating the plate;
- a cooling container containing a refrigerant;
- a cooling module, disposed to touch at least one face of the cooling container, for absorbing a heat from the cooling container to cool the refrigerant in the cooling container to a predetermined temperature by a Peltier effect;
- a supply source of a cooling gas;
- a cooling gas channel connected to the supply source, a portion of which is provided to touch the refrigerant in the cooling container and cooled by touching the refrigerant;
- and
- a nozzle for jetting the cooling gas which has passed through the cooling gas channel toward the plate.
11 more elements
A method for forming a resist pattern on a substrate, comprising:
- a first resist pattern forming step of performing exposure processing for a substrate coated with a resist by use of a first reticle, heating the exposed substrate by a hot plate heated to a first temperature, and thereafter supplying a developing solution to a front face of the substrate to develop the same;
- a second resist pattern forming step of performing exposure processing for a substrate coated with the resist by use of a second reticle, heating the exposed substrate by the hot plate heated to a second temperature lower than the first temperature, and thereafter supplying the developing solution to a front face of the substrate to develop the same;
- a step of exchanging the first reticle for the second reticle, which is performed between the first resist pattern forming step and the second resist pattern forming step;
- a step of absorbing a heat from a cooling container by a Peltier effect of a cooling module to cool a refrigerant in the cooling container to a predetermined temperature;
- and
- a step of providing a cooling gas channel so that the cooling gas channel touches the refrigerant in the cooling container and supplying a cooling gas which is cooled by flowing through the cooling gas channel to the hot plate to lower the temperature of the hot plate from the first temperature to the second temperature.
3 more elements
A method for forming a resist pattern on a substrate, comprising:
- a first resist pattern forming step of performing exposure processing for a substrate coated with a resist by use of a first reticle, heating the exposed substrate by a hot plate heated to a first temperature, and thereafter supplying a developing solution to a front face of the substrate to develop the same;
- a second resist pattern forming step of performing exposure processing for a substrate coated with the resist by use of a second reticle, heating the exposed substrate by the hot plate heated to a second temperature lower than the first temperature, and thereafter supplying the developing solution to a front face of the substrate to develop the same;
- a step of exchanging the first reticle for the second reticle, which is performed between the first resist pattern forming step and the second resist pattern forming step;
- a step of absorbing a heat from a cooling container by a Peltier effect of a cooling module to cool a refrigerant in the cooling container to a predetermined temperature, which is performed during the first resist pattern forming step;
- and
- a step of providing a cooling gas channel so that the cooling gas channel touches the refrigerant in the cooling container and supplying a cooling gas which is cooled by flowing through the cooling gas channel to the hot plate to lower the temperature of the hot plate from the first temperature to the second temperature, which is performed during the step of exchanging the reticles.
3 more elements
A processing apparatus comprising:
- a heat processing apparatus having a hot plate for heating a substrate, a heater disposed to be integrated structurally with the hot plate, and a nozzle for blowing a cooling gas onto a rear face of the hot plate;
- and
- a transfer mechanism transferring the substrate from an aligner to the heat processing apparatus.
Dependencies are inferred from the claim text.