Heat sink assembly retainer for electronic integrated circuit package
AssigneeHon Hai Precision Ind. Co., Ltd.
InventorsYoshitsugu Koseki, Hung-Ji Yu
Life of this patent
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AssigneeHon Hai Precision Ind. Co., Ltd.
InventorsYoshitsugu Koseki, Hung-Ji Yu
Estimating the term…
A retainer device (1) for fastening a heat sink (2) to a printed circuit board module (3). The heat sink comprises a base plate (22) and a plurality of upwardly extending fins (24). The retainer device comprises an operation lever (14), a fastening frame (12), and a backing plate (16) attached to a bottom surface of the module. Clasp hooks (162) of the backing plate hold the fastening frame in place. The fastening frame has pairs of pivot openings (129), cam plates (128), and cutouts (130). The operation lever includes an operational body (142), a pair of arms (144), a pair of U-shaped urging portions (146), and a pair of pivot axles (148) passing through the pivot openings. The operational body is rotated to make the urging portions pass around the cam plates into the cutouts. The heat sink is thereby pressed tightly against the printed circuit board module.
A retainer device fastening a heat sink to a printed circuit board module, comprising:
A heat sink assembly for being mounted on a circuit board module, comprising:
A heat sink assembly comprising:
Dependencies are inferred from the claim text.