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US 6,472,331 B1Granted
Method and apparatus for measuring and dispensing a wafer etchant
AssigneeChartered Semiconductor Manufacturing Ltd.
InventorKam Beng Chong
Life of this patent
Estimating the term…
Abstract
A tank is set up to hold a precise volume of acid by first adjusting an overflow pipe to establish a volume that is larger than the desired volume and then adjusting the vertical position of a volume occupying element that extends above and below the surface of the acid. The apparatus includes a drain pipe for directing the acid to a tank that holds deionized water that the acid is mixed with. The bath is used for etching a silicon dioxide layer on a semiconductor wafer.
Claims4
A method for forming an acid bath for etching a semiconductor wafer, comprising the following steps,
- providing a tank for holding the acid component of the bath,
- providing an overflow pipe for the tank and thereby establishing an overflow level at which an acid added to the tank overflows the pipe, the overflow level defining an overflow volume of acid that can be contained inside the tank below the overflow level, the overflow volume being larger than the volume of acid to be supplied to the bath,
- locating a volume occupying element inside the tank at a position where the volume occupying element extends above and below the overflow level,
- and adjusting the position of the volume occupying element with respect to the overflow level to provide said volume of acid to be supplied to the bath when the tank is filled to the overflow level,
- and emptying the tank into a bath containing the water component of the acid bath.
2 more elements
Dependencies are inferred from the claim text.