Method of manufacturing trench type element isolation structure
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsYoshihiko Kusakabe, Yasuki Morino
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AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsYoshihiko Kusakabe, Yasuki Morino
Estimating the term…
The present invention is directed to a method of manufacturing a trench type semiconductor element isolation structure including the steps of: (i) forming a silicon oxide film on a silicon substrate and forming a silicon nitride film on the silicon oxide film; (ii) forming a groove penetrating the silicon nitride film and the silicon oxide film, said groove reaching an interior of the silicon substrate; (iii) forming a thermal oxide film on an inner wall of said groove; (iv) depositing an oxide in said groove; (v) subjecting said oxide to a polishing treatment with the silicon nitride film used as a stopper layer, so that a part of the insulator is removed; (vi) etching the oxide by a predetermined amount of said oxide after completing the step (v); (vii) etching the silicon nitride film after completing the step (vi); and (viii) etching the silicon oxide film after completing the step (vii).
A method of manufacturing a trench type semiconductor element isolation structure comprising steps of:
A method of manufacturing a trench type semiconductor element isolation structure comprising steps of:
A method of manufacturing a trench type semiconductor element isolation structure comprising steps of:
Dependencies are inferred from the claim text.