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US 6,472,315 B2Granted
Method of via patterning utilizing hard mask and stripping patterning material at low temperature
AssigneeIntel Corporation
InventorsPhi L. Nguyen, Lawrence D. Wong
Life of this patent
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Abstract
A method for fabricating an interconnect system is provided. A low dielectric constant layer (LDCL) is formed onto a substrate. A hard mask is formed onto the LDCL. A patterning material is formed onto the hard mask. The patterning material is via patterned. A via pattern of the patterning material is transferred to the hard mask. The patterning material is stripped at a substantially low temperature. Vias are formed through the LDC using a via pattern formed in the hard mask.
Claims6
A method, comprising:
- forming a low dielectric constant layer (LDCL) onto a substrate;
- forming a hard mask onto said LDCL;
- forming a patterning material onto said hard mask;
- via patterning said patterning material;
- transferring a via pattern of said patterning material to said hard mask;
- stripping said patterning material by applying a solvent to said patterning material at a substantially low temperature, the solvent consists essentially of ethylene glycol monethyl ether acetate, propylene glycol monethyl ether acetate, ethyl lactate, ethyl pyruvate, and methyl-3-methoxy propionate;
- and
- forming vias through said LDCL using a via pattern formed in said hard mask.
5 more elements
A method, comprising:
- forming a low dielectric constant layer (LDCL) having a dielectric constant about in the range of 3.5 or less onto a substrate;
- forming a first hard mask onto said LDCL and forming a second hard mask onto said first hard mask;
- forming a patterning material onto said second hard mask;
- via patterning said patterning material;
- transferring a via pattern of said patterning material to said first hard mask;
- stripping said patterning material at a substantially low temperature with a stripping material consisting of ethylene glycol monethyl ether acetate, propylene glycol monethyl ether acetate, ethyl lactate, ethyl pyruvate, and methyl-3-methoxy propionate;
- and
- forming via openings through said LDCL using a via pattern formed in said first hard mask.
5 more elements
Dependencies are inferred from the claim text.