Diamond barrier layer
AssigneeLSI Logic Corporation
InventorsWilbur G. Catabay, Zhihai Wang
Life of this patent
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Abstract
A method of forming an electrically conductive interconnect on a substrate. An interconnection feature is formed on the substrate, and a first barrier layer is deposited on the substrate. The first barrier layer consists essentially of a diamond film. A seed layer consisting essentially of copper is deposited on the substrate, and a conductive layer consisting essentially of copper is deposited on the substrate. Thus, by using a diamond film as the barrier layer, diffusion of the copper from the conductive layer into the material of the substrate is substantially reduced and preferably eliminated.
Claims16
A method of forming an electrically conductive interconnect on a substrate, the method comprising the steps of:
- (a) forming an interconnect feature on the substrate,
- (b) depositing a first barrier layer on the substrate, the first barrier layer consisting essentially of a diamond film,
- (c) depositing a seed layer consisting essentially of copper on the substrate, and
- (d) depositing a conductive layer consisting essentially of copper on the substrate.
A method of forming an electrically conductive interconnect on a substrate, the method comprising the steps of:
- (a) forming an interconnect feature on the substrate,
- (b) depositing a first barrier layer on the substrate, the first barrier layer consisting essentially of a diamond film,
- (c) depositing a second barrier layer on the substrate, the second barrier layer consisting essentially of at least one of tantalum, tantalum nitride, tungsten nitride, and titanium silicon nitride, the first barrier layer and the second barrier layer defining a composite barrier layer,
- (d) depositing a seed layer consisting essentially of copper on the substrate,
- (e) electroplating a conductive layer consisting essentially of copper on the substrate, and
- (f) planarizing the electrically conductive interconnect to a level substantially planar with a top surface of the substrate.
Dependencies are inferred from the claim text.