Method for forming storage node contact
AssigneeHynix Semiconductor Inc.
InventorKyong-sik Yoo
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AssigneeHynix Semiconductor Inc.
InventorKyong-sik Yoo
Estimating the term…
In a method for forming a storage node contact, the inorganic SOG layer is deposited and heat-treated after forming a bit line having a conductive layer and a spacer on the semiconductor substrate and accordingly, there is an advantage that the density of the organic SOG layer embedded between the bit lines become lower than that of the organic SOG layer stacked on the bit lines. As a result, when performing the wet etching process, the speed for etching the inorganic SOG layer between the bit lines become very rapid, so that an artificial void is formed, an etching become very easier when performing a dry etching process of a deep storage node contact junction part. According to the present invention, the characteristic and yield of the semiconductor device become increased. Also, the present invention is very useful and effective because the high integration of the semiconductor device is possible.
A method for forming a storage node contact comprising the steps of:
Dependencies are inferred from the claim text.